Systems Architecture

Get Arbitrary Modeling of TSVs for 3D Integrated Circuits PDF

By Khaled Salah,Yehea Ismail,Alaa El-Rouby

This booklet provides a wide-band and know-how autonomous, SPICE-compatible RLC version for through-silicon vias (TSVs) in 3D built-in circuits. This version debts for numerous results, together with dermis impact, depletion capacitance and close by touch results. Readers will reap the benefits of in-depth assurance of innovations and expertise akin to 3D integration, Macro modeling, dimensional research and compact modeling, in addition to closed shape equations for the via silicon through parasitics. options lined are validated through the use of TSVs in purposes similar to a spiral inductor and inductive-based communique procedure and bandpass filtering.

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Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing) by Khaled Salah,Yehea Ismail,Alaa El-Rouby

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